[cloasters]

Originally Posted by timbob2469

Well , I'm holding off for a little bit before trying this ($75.00 is still $75.00- that's what I paid for the samsung pc3200). Maybe OCZ is accomplishing something else besides thinning the outer layer of the chips by their use of CO 2 laser ? Have you read the article ? On second look it just seems too simple and the information (or dis-information) about the process is just too easy to get.
Copied from the article," Samsung semi will provide die location information , we will be using the DP-7 CO 2 laser to remove the surface material from the package face only average laser cut depth is 7mill . After surface removal the package should be sent to ISE for environmental test and then re-speed graded after speed grade and classification chips will be marked ( standard process) and standard process thereafter."
I also run 2 X 256MB of OCZ pc3500 EL , on my main rig, they have heatspreaders and I'm not about to pull them off and void the warranty. But I did pull 1 256MB module out of my backup pc late last night, There are on-die components (capacitors, resistors? ) that are not that far below the surface of the chipface, so using a laser would allow thinning at the exact location of the chipface, my proposed method (beltsander) is probably too crude, I might try lapping them 1 chip at a time on a narrow strip of abrasive. Also I noticed these are the "D" chips, not the "E" type that they are using to make PC3700 GOLD from. So I think I'll get a stick of lower cost DDR memory.

It's probably the "screened" chips that make most of the difference. The cooling story just might be padding to help justify the high cost of this hand picked RAM! The idea of removing a few microns from the surface of the memory chips without an expensive machine shop at your disposal is humorous. Using a belt sander would be akin to adjusting the innards of a Rolex with a hammer.