[Liquid3D]

Just as processor scaling has resulted in new technologies to prevent static current leakage into surrounding semi-conductive silicon (SOI). So the Thermal Management industry has had to evolve in it's TIM formulae. Nanotherm has been around a few years and has released some excellent products, their Silver XTC being as effective as AS3 (in my opinion).

Since lapping my P4's, and testing Thermalright heatsinks, I wanted to find the best thermal transfer material, for these newly prepared (lapped) surfaces. As you can see Nanotherms newer product which comes in a "dopper" bottle due to it's liquidity. PCM+ is described as phase change material, and that is exactly what it seems to do. In the pohoto's below you'll notice the substnace is a combination of two elements. The blue paraffin material I believe acts as an "encpsulate," and a thinner oil-like, substance (refecting white in pics) which I believe undergoes the phase change. It's difficult to discriminate in these photo's, but theres a clear difference when applying the substance. It took me nearly five different applications, because i kept overcompensating, applying much mor then needed. One need only "moisten the surface with PCN+, not ensure it's all covered in thicker blue. For it's the oily substance which most likely "boils" absorbing the energy (heat) from the IHS or processor surface, and transferring this energy to the heat-sink plate. I believe this formula (if not patented) will be te next phase (pun intended) in TIMs. My temps dropped from 38C/42C to 31C/33C. I consider that revolutionary! Initially I failed to follow Nanotherm's intsuctions, which specifies one must apply a thin (very thin only three drops max for P4 IHS one for AMD) coating to BOTH mating surfaces. The core, and the heatsinks plate should be rubbed with PCM+ (using plastic wrap over your finger).