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Old 2nd April, 2004, 09:04 PM
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No wonder it was unstable...

I just replaced the stock HSF on my P3 933MHz with something much better. It turns out there was almost ZERO TIM between the processor and the HS, and on top of that, there was a sheet of what appears to be TIN FOIL between the HS and processor. this sheet is definetly tin, because aluminum foil is much more flexible.

i will post pics after dinner

the stock heatsink looks to be the exact same thing as on my old P1 200MHz, except with a fan.
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Old 3rd April, 2004, 04:52 AM
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Oh boy!! Had that been an AMD chip it would probably have fried!
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Old 3rd April, 2004, 09:58 AM
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The tinfoil was there to keep space aliens from taking control of your CPU....
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Old 3rd April, 2004, 10:20 AM
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The idea of using a soft metal as an interface isn't a bad one. It's not as forgiving as thermal paste though - much harder to expel air bubbles (which is the whole point of the TIM after all).
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