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  #1 (permalink)  
Old 2nd March, 2002, 08:21 PM
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which is better

thermal grease or thermal pad?some one please answer soon.thanks.
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Old 2nd March, 2002, 09:17 PM
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Thermal grease is better. Most people prefer Arctic Silver 2 or Arctic Silver 3. If for whatever reason you can't get it, the Radio Shack thermal grease works too.
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Old 2nd March, 2002, 09:40 PM
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The phase change glop or metal "stickers" work better as their technology improves. Most OCer's prefer thermal paste. "A little more---for safety's sake" is NOT good with thermal paste. A uniform layer that covers the top of the CPU, 1/1000th of an inch thick is ideal. I'm striving to reach this high standard, haven't got there yet.

Seriously, I put too thick of a layer of AS on a Duron a few months ago. "Better safe than sorry," I told myself. WRONG. I unlazed myself and removed the AS. Replaced it with a paper-thin layer. 4C drop in processor temp with the paper-thin layer. No lie!
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Old 2nd March, 2002, 09:48 PM
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thanks.i love this place.
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Old 3rd March, 2002, 07:42 PM
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Paste is the way, there is no doubt of that.
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Old 3rd March, 2002, 09:05 PM
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Too bad there isn't a way to make the two mating surfaces of the thermal junction truely perfect, perhaps we will some day, in the mean time we will just have to settle for thermal paste . . . .
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Old 4th March, 2002, 01:10 AM
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Quote:
Originally posted by dimmreaper
Too bad there isn't a way to make the two mating surfaces of the thermal junction truely perfect, perhaps we will some day, in the mean time we will just have to settle for thermal paste . . . .
Maybee some sort of Gel heatsink ?

That would mould itself to the exact shape of the core.

Arctic silver is very good..the trick is to get it very thin.
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Old 4th March, 2002, 01:56 AM
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I think that dimmreaper means that a perfect union between processor and HSF does away with the need for thermal paste. Thermal paste's real job is to fill minute crevices so that the contact between CPU and HSF isn't missing in those uneven areas. Dunno if we'll ever see surfaces so perfect that the junction can NOT be improved upon.

Who know's? Maybe a perfect contact will become necessary as processors do even more work. However, these junctions would need to be made in a clean room, AFAIK. Perhaps the day will come when mainboard, processor and HSF will HAVE to be sold in a package. Not good for the less than well heeled.
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