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Old 29th July, 2009, 08:52 PM
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GlobalFoundries Outlines 22 nm Roadmap

David Lammers, News Editor -- Semiconductor International, 7/28/2009

GlobalFoundries (Sunnyvale, Calif.) plans to apply embedded silicon carbon (eSiC) stressors on its 22 nm nFET transistors, and is likely to use through-silicon vias (TSVs) to connect a fast SOI-based DRAM layer to a logic die, said John Pellerin, director of technology development at the IBM/GlobalFoundries Alliance in Fishkill, N.Y.

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Old 23rd August, 2009, 09:18 PM
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How we work at such tiny levels is a wonder. I gather that this will lead to AMD catching up with Intel in a year. Yay!
When the world will be better.
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amd , embedded silicon carbide , esic , globalfoundaries , ibm

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